Heat dissipation effect of Al plate embedded substrate in network system

Decreasing junction temperature in an IC package is required for stable electrical performance and electro-mechanical reliability of network communication system in today’s market. Much effort to decrease the junction temperature is already done. Since it is critical to increase both speed and mass of information transmission, reducing junction temperature needs to be optimized for better electrical performance of IC packages. So, it is necessary to develop more advanced methods to reduce the temperature. Because there is limit on conventional design, such as optimization air flow path and heat sink structure, to dissipate more heat through an exhaust fan system. This paper presents that an Al plate embedded network substrate to decrease the junction temperature of an IC package by experimental and finite element analysis. Results show that good heat dissipation can be enhanced by the Al plate embedded network substrate. It is believed that such network substrate decreases the junction temperature of IC package. FE analysis and experimental results show that an Al plate embedded substrate can reduce the steady-status temperature by about 4–8 °C with an exhaust fan running. Also temperature distribution on the surface of substrate is more equally than that of a conventional substrate by high heat conductivity of Al plate. Thus, it is possible that an Al plate embedded substrate works well with stable electrical performance with low junction temperature in an IC package communication system.